Electronic device and method for manufacturing housing for same
US9538673B2 · kind B2 · utility
0Cited by
0References
5Claims
0Family size
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Key dates
| Filing date | Jul 30, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Aug 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.