Integrated heat exchanger and power delivery system for high powered electronic modules
US9538692B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Aug 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20218
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.