Patent · US Active

Component of a molding system for cooling a molded article

US9539751B2 · kind B2 · utility

0Cited by

6References

4Claims

0Family size

Assignee

Husky Injection Molding Systems Ltd. · CA

Inventors

Joachim Johannes Niewels · Thornton, CA
Scott Michael Stedman · Mississauga, CA
Jean-Christophe Witz · Yutz, FR
Sven Kmoch · Platten, DE
Ralf Walter Fisch · Saarburg, DE
Ruud Maria Theodorus Luijs · Utrecht, NL
Peter Yankov · Bolton, CA

Key dates

Filing date	May 31, 2013
Grant date	Jan 10, 2017
Priority date	—
Expiry date	May 31, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/712
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Disclosed herein, amongst other things is a component (100, 200, 300, 400, 500, 600, 700, 800, 900, 1000) of a molding system (402) (e.g. mold component, post-mold component, etc.) having a heat dissipater (130, 230, 330, 430, 530, 630, 730, 830, 930, 1030) that is configured to impart a profiled heat removal rate on a selected portion of a molded article (120, 220, 320, 420) that generally matches a heat distribution therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.