Bisphenol-A free polyether resins based on phenol stearic acid and coating compositions formed therefrom
US9540484B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2650/56
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Coating compositions can be prepared from a polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, and reacting the diphenol with a diglycidyl ether compound to form the polyether resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.