Patent · US Active

Apparatus for real-time non-contact non-destructive thickness measurement using terahertz wave

US9541377B1 · kind B1 · utility

3Cited by

1References

16Claims

0Family size

Assignee

KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE · KR

Inventors

Dae-Su Yee · Daejeon, KR
Ji-Sang Yahng · Seodaemun-gu, KR

Key dates

Filing date	Nov 9, 2015
Grant date	Jan 10, 2017
Priority date	—
Expiry date	Nov 9, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG01S17/34
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Provided is an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, and more particularly, an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, which is capable of measuring a thickness of a sample by irradiating a terahertz continuous wave, which is generated from a wavelength-fixed laser and a wavelength-swept laser and of which the frequency is changed at a high speed, to the sample and measuring the terahertz wave transmitting or reflected from the sample.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.