RFID chip module
US9542636B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2015 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Jun 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/401
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.