Heat sink for a semiconductor chip device
US9543226B1 · kind B1 · utility
13Cited by
1References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 7, 2015 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Oct 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/167
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.