Surface-mount electronic component
US9543247B1 · kind B1 · utility
1Cited by
12References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 23, 2016 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Feb 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.