Light emitting diode package and method for manufacturing same
US9543283B2 · kind B2 · utility
0Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2014 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Jun 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.