LED package with reflecting cup

US9543486B1 · kind B1 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• HOU-TE LIN · Hsinchu, TW
• PIN-CHUAN CHEN · Hsinchu, TW
• LUNG-HSIN CHEN · Hsinchu, TW
• Wen-Liang Tseng · Hsinchu, TW

Key dates

• Filing date: Nov 19, 2015
• Grant date: Jan 10, 2017
• Expiry date: Nov 19, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/855

Abstract

The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.