Packaging for thermoelectric subcomponents
US9543493B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 21, 2012 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Feb 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/8556
Abstract
A thermoelectric semiconducting assembly. Two parallel plates, a first plate and a second plate, are spaced apart. A plurality of pellets are fitted into said first plate and into said second plate, each said pellet comprising a body, a first cap, and a second cap, said body including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, each pellet in said second plate being connected to a pellet in said first plate. Each pellet includes a doped body, wherein half of said pellets are doped with a p-type dopant to form a p-type pellet and half of said pellets are doped with an n-type dopant to form an n-type pellet. Each plate includes p-type pellets and n-type pellets in an alternating pattern, and each p-type pellet in said first plate connects with an n-type pellet in said second plate, and wherein each n-type pellet in said first plate connects with a p-type pellet in said second plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.