Method of manufacturing mask for deposition
US9543520B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2016 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Apr 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a mask for deposition including forming a second layer on a side of a first layer, coating a photoresist layer on a side of the second layer, forming a plurality of photoresist patterns which penetrate the photoresist layer according to an exposing and developing process, forming a plurality of pattern grooves in the second layer by etching portions of the second layer, which are exposed through the plurality of photoresist patterns, forming an electro-forming mold by removing the photoresist layer from the second layer, disposing an electrode plate to contact the second layer of the electro-forming mold, performing an electro-forming process of growing a metal layer from the electrode plate in spaces in the corresponding pattern grooves of the second layer of the electro-forming mold, to form a deposition mask, and separating the deposition mask from the electrode plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.