Optoelectronic component and method for the production thereof

US9543541B1 · kind B1 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Richard Baisl · Regensburg, DE
• Christoph Kefes · Regensburg, DE
• Michael Popp · Birkenfeld, DE

Key dates

• Filing date: Jun 30, 2014
• Grant date: Jan 10, 2017
• Expiry date: Jun 30, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/00
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.