Folded corrugated substrate integrated waveguide
US9543628B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2013 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Nov 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/16
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A folded corrugated substrate integrated waveguide is disclosed. The folded corrugated substrate integrated waveguide, according to one embodiment of the present invention, comprises: a first conductor plate having upper surface stubs respectively formed on both sides thereof in the lengthwise direction; a first dielectric substrate of which the upper surface is attached to the lower surface of the first conductor plate; a second conductor plate of which the upper surface is attached to the lower surface of the first dielectric substrate; a second dielectric substrate of which the upper surface is attached to the lower surface of the second conductor plate; and two stub conductor arrays spaced at a certain distance so as to be arranged in parallel to each other and attached to the lower surface of the second dielectric substrate, wherein each of the stub conductors in the two stub conductor arrays is electrically connected to a position corresponding to the upper surface stub of the first conductor plate through a via-hole which vertically penetrates the first dielectric substrate, the second conductor plate, and the second dielectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.