Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
US9544057B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2013 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | May 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an interconnect structure for coupling at least one electronic unit for outputting and/or receiving electric signals, and at least one optical unit for converting said electric signals into optical signals and/or vice versa, to a further electronic component. The interconnect structure comprises an electrically insulating substrate (102) and a plurality of signal lead pairs (104, 120) to be coupled between said electronic unit (108, 116) and a front end contact region (106) for electrically contacting said interconnect structure by said further electronic component. A ground plane layer (118) is electrically insulated from said pairs of signal leads (104, 120), wherein each pair of signal leads (104, 120) has a circuit connecting region (122) for electrically contacting respective terminals of said at least one electronic unit (108, 116), and wherein in a region adjacent to said terminals of said at least one electronic unit (108, 116) said ground plane layer (118) has a plurality of clearances (126) that are each allocated to one pair of signal leads (104, 120) and separated from a respective neighboring clearance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.