Method of making a backlight module for a printed circuit board
US9545012B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2013 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Mar 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.