Handling of epoxy resins
US9545783B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2012 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Oct 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1994
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Described herein is an apparatus and a method for removing an epoxy resin from a backing sheet at a temperature at or below the glass transition temperature of the epoxy resin. The apparatus (200) comprises a housing (210) in which is mounted a dispensing roll (220) comprising epoxy resin (230) on a backing sheet (240), a wind-up roll (250) comprising the backing sheet (240), a release element (260) over which the backing sheet (240) is directed, and a collection tray (270) for collecting pieces of resin (230a) removed from the backing sheet (240). The dispensing and wind-up rolls (220, 250) are mounted on respective drive shafts (225, 255) which are driven by a drive mechanism (285) controlled by a controller (280). A temperature controller (290) is also provided for controlling the temperature within the housing (210) so that it remains below or at the glass transition temperature of the epoxy resin. Angle (αa) is chosen to optimize the peel-back angle of the backing sheet (240) after is passes over the release element (260) in relation to the relative spacing between the dispensing and wind-up rolls (220, 250) and the release element (260).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.