Filled two-component curable epoxy system with enhanced sedimentation stability
US9546260B2 · kind B2 · utility
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11References
10Claims
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Key dates
| Filing date | Mar 25, 2010 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure relates to a curable system comprising at least two compositions (A) and (B) where composition (A) comprises an epoxy resin, an inorganic thixotropic agent, an organic gelling agent and a filler and composition (B) comprises a hardener, an inorganic thixotropic agent, an organic thixotropic agent and filler. The curable system may be used in the manufacture of components or parts of electrical equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.