Patent · US Active

Filled two-component curable epoxy system with enhanced sedimentation stability

US9546260B2 · kind B2 · utility

0Cited by
11References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 2010
Grant dateJan 17, 2017
Priority date
Expiry dateAug 7, 2030

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L63/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The present disclosure relates to a curable system comprising at least two compositions (A) and (B) where composition (A) comprises an epoxy resin, an inorganic thixotropic agent, an organic gelling agent and a filler and composition (B) comprises a hardener, an inorganic thixotropic agent, an organic thixotropic agent and filler. The curable system may be used in the manufacture of components or parts of electrical equipment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.