High-temperature process improvements using helium under regulated pressure
US9546434B2 · kind B2 · utility
0Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Jan 24, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T117/1024
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for minimizing unwanted ancillary reactions in a vacuum furnace used to process a material, such as growing a crystal. The process is conducted in a furnace chamber environment in which helium is admitted to the furnace chamber at a flow rate to flush out impurities and at a predetermined pressure to achieve thermal stability in a heat zone, to minimize heat flow variations and to minimize temperature gradients in the heat zone. During cooldown helium pressure is used to reduce thermal gradients in order to increase cooldown rates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.