LED assembly
US9546762B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 15, 2014 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Oct 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8513
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.