Packaged sensor with integrated offset calibration
US9546925B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Jul 10, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P21/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mechanism is provided to field adjust offset values for packaged sensors incorporated in devices. Embodiments provide for a processor in the sensor package to measure current environmental conditions and set a zero offset for the sensors in the package in light of those current environmental conditions. In this manner, any changes in the sensor over the sensor's lifetime and current environmental conditions that can affect functioning of the sensor can be accounted for in operational measurements taken by the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.