Positive photosensitive resin composition, method for forming polyimide resin patterns, and patterned polyimide resin film
US9547239B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
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Key dates
| Filing date | Oct 25, 2013 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Oct 25, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/26
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by photolithography, and provides patterns with excellent heat resistance, and a method for forming polyimide resin patterns using the positive photosensitive resin composition. A patterned polyimide resin film formed by the method for forming polyimide resin patterns. To the photosensitive resin composition are added a polyimide resin, and a compound in which an imidazole compound having a specific structure is generated by the action of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.