Connection member, semiconductor device, and stacked structure
US9548279B2 · kind B2 · utility
3Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2014 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Aug 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0919
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.