Thermally managed load module with embedded conductors
US9548599B2 · kind B2 · utility
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Key dates
| Filing date | Nov 5, 2014 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Nov 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02B1/056
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A load module for a power module in which the power module includes a housing assembly. The load module includes an epoxy body and a number of elongated conductive strands. Each of the conductive strand are partially disposed in the epoxy body and each of the conductive strands includes a conductive member and a limited insulator. Each of the limited insulators is disposed on selected portions of an associated conductive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.