Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound
US9550877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Mar 10, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is directed to provide at least one of a novel thermosetting resin composition using an epoxy compound, a method for producing the composition, a method for producing a novel cured resin using an epoxy compound, and a novel method for causing self-polymerization of an epoxy compound. The thermosetting resin composition includes an epoxy compound, a gallium compound, and a silanol source compound. The method for producing the thermosetting resin composition includes a step of mixing the epoxy compound with the gallium compound and the silanol source compound. The method for producing a cured resin includes a step of heating an epoxy compound in the presence of a gallium compound and silanol. The method for causing self-polymerization of an epoxy compound is characterized by using a gallium compound and silanol as catalysts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.