Thermal lamination adhesive coatings for use on substrates
US9550930B2 · kind B2 · utility
1Cited by
32References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | May 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Lamination adhesives including an aqueous dispersion having a mixture of a polyamide and an ethylene acrylic acid copolymer are provided for use on a variety of substrates. In various embodiments, the aqueous dispersion is substantially free of plasticizers and non-aqueous organic solvents. Also provided is a method of forming a laminate adhesion between two substrates. The disclosure also describes a laminate structure comprising first and second substrates laminated together by the lamination adhesive, the lamination adhesive including a mixture of a polyamide and a copolymer of ethylene and acrylic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.