Profiling tool for determining material thickness for inspection sites having complex topography
US9551690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2012 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Jun 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E30/30
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A phased array ultrasonic probe may be mounted to a component to be inspected for wall thickness on an apparatus that includes a split ring adapted to be magnetically held in place on the component. In particular, the probe may be mounted to a carriage connected to the split ring in a manner that allows the carriage to rotate around the split ring while the probe is in operation. Between the probe and the component, a transducer shoe defining, by a flexible membrane, a cavity and an aperture. Conveniently, the construction of the flexible membrane allows wall thickness measurements to be acquired in portions of the component that have complex topography, such as welds. The apparatus is installed on an adaptor assembly for inspection of straight section of pipes. This adaptor assembly is not used in absence of straight section. By acquiring data from multiple output pulse transmitted at multiple incidence angles, processing software may conveniently produce an accurate wall thickness map of the area of interest on the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.