Package, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object
US9551729B2 · kind B2 · utility
0Cited by
7References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 24, 2014 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Apr 4, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A package includes a base portion, and a lid which is placed on the base portion to define an inner space with the base portion and has a metal plate layer and a brazing material layer that is laminated on the metal plate layer, in which the base portion has a metalized layer which is joined with the brazing material layer around the inner space in a plane view, and the brazing material layer has a protrusion which protrudes in a opposite direction of the base portion on an outer peripheral side surface of the metal plate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.