Fingerprint sensor module, portable electronic device including same, and method for manufacturing same
US9552508B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2016 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Aug 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a fingerprint sensor module having excellent sensing sensitivity, to a portable electronic device including same, and to a method for manufacturing same. According to one embodiment of the present invention, a fingerprint sensor module is provided which includes: a sensing unit formed on a substrate using a conductive body; a fingerprint sensor having a sensor circuit unit electrically connected to the sensing unit; a bracket accommodating the sensing unit and receiving the fingerprint sensor; and a post-processing layer positioned on a contact surface formed on the bracket so as to face the upper surface of the sensing unit. The sum of the thickness of a supporting layer between the upper surface of the sensing unit and the contact surface, and the thickness of the post-processing layer is 0.04 mm to 0.06 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.