Semiconductor cooling apparatus
US9553038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2012 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Mar 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.