Apparatus for controlling heat flow
US9553083B2 · kind B2 · utility
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1References
10Claims
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Key dates
| Filing date | Jul 21, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Jul 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus configured to control a heat flow is provided. The apparatus may include a semiconductor device region formed in a matrix; a heat rectifier region formed adjacent to the semiconductor device region; and a heat flow blocker formed in at least one region contacting the semiconductor device region and the heat rectifier region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.