Light emitting device and light emitting device package

US9553239B2 · kind B2 · utility

Assignee

• Rohm Co., Ltd. · JP

Inventors

• Takao Fujimori · Kyoto, JP
• Nobuaki Matsui · Kawasaki, JP

Key dates

• Filing date: Feb 5, 2014
• Grant date: Jan 24, 2017
• Expiry date: Mar 25, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/835

Abstract

A light emitting device includes a first conductive-type semiconductor layer laminated on a substrate; a light emitting layer laminated on the first conductive-type semiconductor layer; a second conductive-type semiconductor layer laminated on the light emitting layer; a first ITO layer laminated at a side of the first conductive-type semiconductor layer opposite to the substrate; a second ITO layer laminated at a side of the second conductive-type semiconductor layer opposite to the substrate; a first metal layer laminated on the first ITO layer; and a second metal layer laminated on the second ITO layer. The first and second metal layers have the same structure and each includes a lower metal layer which contacts a corresponding ITO layer of the first ITO layer and the second ITO layer; and an upper metal layer laminated on the lower metal layer, the upper metal layer being thicker than the lower metal layer.