Patent · US Active

Process of structuring an active organic layer deposited on a substrate

US9553266B2 · kind B2 · utility

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11Claims
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Key dates

Filing dateMar 20, 2014
Grant dateJan 24, 2017
Priority date
Expiry dateMar 20, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10K71/221

Abstract

A method of structuring an active organic layer deposited on a substrate, including depositing a sacrificial layer on the substrate by photolithography, the sacrificial layer being made of at least one resist, creating at least one pattern inside of the sacrificial layer, depositing an active organic layer on the sacrificial layer and in the pattern, depositing a protective layer made of organic polymer on the active layer and in the pattern of the resist sacrificial layer, removing the sacrificial layer by projection of a solvent on the resin forming the layer, and removing the protective layer by dissolving the polymer forming it in a solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.