Antenna module and method for manufacturing the same
US9553370B2 · kind B2 · utility
0Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2014 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | May 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48464
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.