Patent · US Active

Headphone socket assembly and electronic equipment including same

US9553382B2 · kind B2 · utility

1Cited by

4References

8Claims

0Family size

Assignee

XIAOMI · CN

Inventors

Wei Sun · Beijing, CN
Feng Guo · 安丰镇, CN
Zhenfei Lei · Beijing, CN

Key dates

Filing date	Dec 30, 2014
Grant date	Jan 24, 2017
Priority date	—
Expiry date	Dec 30, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01R24/58
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A headphone socket assembly for use in electronic equipment, includes: a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.