Package structure for photonic transceiving device
US9553671B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Sep 6, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/421
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.