Circuit materials, circuit laminates, and articles formed therefrom
US9554463B2 · kind B2 · utility
5Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2015 |
| Grant date | Jan 24, 2017 |
| Priority date | — |
| Expiry date | Mar 4, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 μm, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.