Method for producing silicon microneedle arrays with holes and microneedle array
US9555229B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2012 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | May 10, 2035 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61M2037/0053
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for producing silicon microneedle arrays with drilled holes includes producing a silicon microneedle array. For each microneedle in a plurality of microneedles in the microneedle array, a laser is positioned relative to a microneedle and a drilled hole is drilled into the microneedle array by laser drilling. The drilled holes are drilled in microneedles, in flanks of the microneedles or alongside microneedles. A microneedle array includes a substrate composed of a micromechanical semiconductor material. The microneedle array has microneedles that project from the substrate and has drilled holes. The microneedles are composed of a porous micromechanical semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.