Spatial deposition of material using short-distance reciprocating motions
US9556514B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jan 23, 2015 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Feb 13, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Deposition of material is performed on a substrate by causing short-distance reciprocating motions of the substrate that improve uniformity of material on the substrate. A series of reactors for injecting material onto the substrate is arranged along the length of the substrate in a repeating manner. During each reciprocating motion, the susceptor moves a distance shorter than an entire length of the substrate. Portions of the substrate are injected with materials by a subset of reactors. Since the movement of the substrate is smaller, a linear deposition device including the susceptor may be made smaller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.