Heat pump apparatus
US9557085B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2010 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Oct 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/70
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In a heat pump apparatus, it is aimed to enhance efficiency of a defrost operation by reducing a loss of heat radiation during the defrost operation and reducing a compressor input during the defrost operation. The heat pump apparatus includes a main refrigerant circuit in which a compressor, a first heat exchanger, an expansion mechanism, and a second heat exchanger are connected sequentially, and also includes a bypass circuit including an on-off valve and providing a connection by bypassing the expansion mechanism. The main refrigerant circuit includes a four-way valve that switches between a heating operation and the defrost operation by switching an order in which the refrigerant circulates through the main refrigerant circuit. The main refrigerant circuit also includes a first temperature detection unit and a second temperature detection unit. Based on values detected by these temperature detection units, a degree of superheat of the first heat exchanger during the defrost operation is computed. When the heating operation is switched to the defrost operation, the heat pump apparatus increases a circulation amount of the refrigerant circulating through the refrigerant circuit …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.