Package for a semiconductor device
US9559038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2015 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Aug 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/564
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.