Semiconductor device
US9559055B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2015 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Jan 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a fuse element that can be cut and removed by laser irradiation. The fuse element has a large width portion having a large sectional area to be irradiated with a laser spot, and two small width portions having a small sectional area connected to opposite sides of the large width portion. Penetration of moisture is suppressed even after cutting of the fuse element since the large width portion is removed by the laser irradiation and only the small width portions having the small sectional area remain as exposed cut surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.