Ink composition for manufacturing light absorption layer including metal nano particles and method of manufacturing thin film using the same
US9559243B2 · kind B2 · utility
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2References
5Claims
0Family size
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Key dates
| Filing date | Jan 6, 2015 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Jan 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed are an ink composition for manufacturing a light absorption layer including metal nano particles and a method of manufacturing a thin film using the same, more particularly, an ink composition for manufacturing a light absorption layer including copper (Cu)-enriched Cu—In bimetallic metal nano particles and Group IIIA metal particles including S or Se dispersed in a solvent and a method of manufacturing a thin film using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.