Power system-on-chip architecture
US9560722B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Mar 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lighting device is provided. The lighting device includes a substrate, integrated circuits (22′, 24), embedded passive components (26, 27), and a lighting component (22), the device being arranged in an architecture having three layers: an integrated circuits layer (11) including the integrated circuits (22′, 24), wherein the integrated circuits layer (11) is integrated on a first side of the substrate; an embedded passive components layer (12) including the embedded passive components (26, 27), wherein the embedded passive components (26, 27) are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits (22′, 24) through vias (28) in the substrate; and a bonded layer (13), including the lighting component (22), the lighting component (22) being connected to the integrated circuit layer (11) through flip-chip bonding or monolithic integration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.