Circuit board via configurations for high frequency signaling
US9560741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2014 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Feb 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1059
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.