Package for optical module
US9560763B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Dec 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package for optical module includes a flat-plate-shaped metal base, and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, and which is joined to an upper surface of the metal base by soldering. The ceramic circuit board has a shape change portion in which the ceramic circuit board is changed in shape along the longitudinal direction, and a region of the ceramic circuit board not including the shape change portion is joined to the metal base by soldering. The shape change portion of the ceramic circuit board is a portion where a width is changed along the longitudinal direction, or a portion where a thickness is changed along the longitudinal direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.