Method of fabricating a circuit board
US9560774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Jan 31, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.