Cylindrical lapping
US9561576B2 · kind B2 · utility
0Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2014 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.