Method and apparatus for sky-line potting
US9561604B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2012 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Nov 20, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2863/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.