Patent · US Active

Devices for bonding parts to be joined

US9561617B2 · kind B2 · utility

1Cited by
2References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 8, 2016
Grant dateFeb 7, 2017
Priority date
Expiry dateApr 8, 2036

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24479
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A device is provided for producing a bonded joint between fiber-reinforced thermoplastic parts to be joined, in which fiber-containing plastic material is mixed into the joining zone while friction stir welding the parts to be joined in the form of a butt joint.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.